The Datacon 2200 Evo platform of highly flexible and configurable Multi Chip Die Attach systems. Delivering high placement accuracy and repeatability whilst maintaining performance only achievable through a truly industrialised platform.
The Datacon 2200 EVO high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for Flip Chip applications. Equipped with integrated dispenser, 12' wafer handling, automatic tool changer and application specific tooling, the Datacon 2200 EVO is prepared for present and future processes and products. The Datacon 2200 EVO Plus is enhanced further with key features for higher bonding accuracy, achieving + 7 microns and 3 sigma X/Y placement accuracy. Besides unbeaten flexibility and full customization possibilities, this evolutionary machine offers higher accuracy with long-term stability, using a new camera system and thermal compensation algorithm. The Datacon 2200 EVO hs achieves the same outstanding placement accuracy of the EVO Plus, however through the implementation of a new image capture and processing unit, offers unprecedented performance of up to 12,000 UPH.
Datacon 2200 evo goes PLUS! VISION ALIGNMENT INTEGRATED DISPENSER PICK & PLACE HEAD FOIL MOLDING Future Proof Equipment www.besi.com Datacon 2200 evo Innovative Solution for Innovative Products The Datacon 2200 evo s enhanced with key features for higher bonding accuracy and lower cost-of-ownership. The Datacon 2200 evoplus die bonder for Multi Module Attach assembles all kinds of technologies on a tried-and-tested platform, enhanced with key features for.
- Highest accuracy ± 10 µm @ 3 Sigma
- High productivity, low cost-of-ownership
- Up to 4 working heads in one machine
- Single pass production for complex products
- Die Attach, Flip Chip, Multi-Chip in one machine
- Epoxy writing & stamping and flux dipping capabilities
- Die pick from wafer, waffle pack, gel pack, feeder
- Die place to carrier, boat, substrate, PCB, lead frame, wafer
- Hot and cold processes supported: epoxy, soldering, thermo-compression
- MCM, SiP, Hybrids
- Most advanced modular platform concept
- Production line tailored 100% to your needs
- Ideal solution with smallest footprint possible
High Performance with unbeatable accuracy
Multi-Chip Capability
Unbeaten Flexibility
Open Platform Architecture for Full Customization
- X/Y placement accuracy ±10 µm
- 3 sigma
- Heated bond head (optional) up to 350 °C
- Bond force 0 - 10,000 g (programmable)
- Die attach die size 0.17 mm - 50 mm
- Flip Chip die size 0.8 mm - 50 mm
- Die thickness 0.02 mm - 7 mm
- Wafer size 4' - 12'
- Working range 13' x 8'
- Dispenser Types: Pressure/time, Volumetric (Auger-screw type), High-performance D-style pump, Jetter
- Epoxy Stamping Reservoir: Setting range 0.1 mm - 5 mm (0.004' - 0.19')
- Slide Fluxer: Various cavity plates available
- Single System size: W 1,200 mm x D 1,225 mm x H 2,000 mm
- Single System weight: 1,300 kg
- Pressure/time (Musashi®), Auger, Jetter types available
- Epoxy stamping option
- Filled and unfilled epoxy, wide viscosity range
- Small footprint, low cost-of-ownership
- New high-speed image processing unit
- Full alignment & bad mark search
- Pre-defined fiducial geometry & customized teaching
- Fully automatic cycle for multi-chip production
- Up to 7 pick & place tools (optionally 14), 5 eject tools
- Stamping tools and calibration tools possible
- Die Attach, Flip Chip and Multi-Chip in one machine
- Die pick from: wafer, waffle pack, Gel-Pak® feeder
- Die place to: substrate, boat, carrier, PCB, leadframe, wafer
- Hot and cold processes supported: epoxy, soldering, thermo-compression, eutectic
Integrated Dispenser
Vision Alignment
Automatic Wafer and Tool Changer
Pick & Place Head
- X/Y placement accuracy: ± 7 µm
- Theta placement accuracy: ± 0.15 o
- 3s
- Die attach: up to 7,000 UPH/module
- Flip Chip with dipping up to 2,500 UPH/module
- Flip Chip without dipping up to 3,200 UPH/module
- Standard bond head 0° - 360° rotation
- Heated bond head (optional)
- Footprint: LxDxH: 1,160 mm x 1,225 mm x 1,800 mm
- Die size Die Attach: 0.17 mm - 50 mm
- Die size Flip Chip: 0.5 mm - 50 mm
- Die thickness: 0.05 mm - 7 mm
- Wafer size: 2' -12' (50 mm - 300 mm)
- Frame size: 5' - 15' (125 mm - 375 mm)
- Waffle pack / Gel-Pak® 2' x 2' and 4' x 4'
- JEDEC tray on request
- Substrate working range: 13' x 8'(325 mm x 200 mm)
- Multi-chip
- Fully automatic cycle for Multi-chip production
- Up to 7 Pick & Place tools (optionally 14), 5 eject tools
- Pressure/time (Musashi®), Auger, Jetter type dispensers available
- Epoxy stamping option
- Filled and unfilled epoxy, wide viscosity range Accuracy
- New high-speed image processing unit
- Full alignment & Bad mark search
- Pre-defined fiducial geometry & customized teaching Pick & Place Head
- Die Attach, Flip Chip and Multi-Chip in one machine
- Die pick from: wafer, waffle pack, Gel-Pak®, feeder
- Die place to: substrate, boat, carrier, PCB, leadframe, wafer
- Hot and cold processes supported: epoxy, soldering, thermo-compression, eutectic
- Fully automatic cycle for Multi-Chip production
- Up to 7 Pick & Place tools (optionally 14), 5 eject tools
- Pressure/time (Musashi®), Auger and Jetter type dispensers available
- Epoxy stamping option
- Filled and unfilled epoxy, wide viscosity range
- New high-speed image processing unit
- Full alignment & Bad mark search
- Pre-defined fiducial geometry & customized teaching
- Die Attach, Flip Chip and Multi-Chip in one machine
- Die pick from: wafer, waffle pack, Gel-Pak® or feeder
- Die place to: substrate, boat, carrier, PCB, leadframe or wafer
- Hot and cold processes supported: epoxy, soldering, thermo-compression and eutectic
Multi-Chip
Accuracy
Pick & Place Head
- X/Y placement accuracy ±7 µm
- 3 sigma
- Theta placement accuracy 0.15°
- 3s
- Standard bond head 0° - 360° rotation
- Heated bond head option
- Footprint 1,160 x 1,225 x 1,800 mm (WxDxH)
- Weight 1,450 kg
- Uptime > 98%
- Yield > 99.95%
- Output up to 12,000 UPH
- Die size Die Attach 0.17 - 5 mm
- Die thickness 0.05 - 2 mm
- Wafer size 2' - 12' (50 - 300 mm)
- Frame size 5' - 15' (125 - 375 mm)
- Waffle pack / Gel pack 2' x 2' and 4' x 4'
- Jedec on request
- Working range 13' x 8' (325 x 200 mm)
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We are always pleased to hear from you.
A member of the Accelonix team will respond back to you as soon as possible
For further information please visit https://www.besi.com/products-technology/productgroup/multi-module-attach/